2016-07-01, 14:35
(2016-07-01, 10:36)looun Wrote: bad news ......i very disappointed.... i not understood .. why use metal case without thermal optimization.
No thermal pad
No link between heatsink to metal case
we hope in the future SPMC support hisilicon soc....
Thanks. Re: Q5 Pro case, that metal bottom is heavy aluminum, and seems exactly same as previous Q5 4K 3D.
Re: SPMC work for HiSilicon, any word from Koying?
