2020-07-16, 06:35
ODROID-N2+ is a revision from ODROID-N2.
– Maximum CPU clock of Quad-core Cortex-A73 is increased to 2.4Ghz from 1.8Ghz.
– Maximum CPU clock of Dual-core Cortex-A53 is increased to 2.0Ghz from 1.9Ghz.
– On-board RTC backup battery holder is mounted on the board.
The main CPU is based on big.Little architecture which integrates a quad-core ARM Cortex-A73 CPU cluster and a dual core Cortex-A53 cluster with a new generation Mali-G52 GPU.
Thanks to the modern 12nm silicon technology, the A73 cores run at 2.2Ghz without thermal throttling using the stock metal-housing heatsink allowing a robust and quiet computer.
The CPU multi-core performance is around 20% faster and the GPU is 10% faster than the N1. The N2+’s DDR4 RAM is running at 1320Mhz with 1.2volt low power consumption.
The large metal housing heatsink is designed to optimize the CPU and RAM heat dissipation and minimize throttling. The CPU is placed on the bottom side of the PCB to establish great thermal characteristics.
More information is on our WiKi.
– Maximum CPU clock of Quad-core Cortex-A73 is increased to 2.4Ghz from 1.8Ghz.
– Maximum CPU clock of Dual-core Cortex-A53 is increased to 2.0Ghz from 1.9Ghz.
– On-board RTC backup battery holder is mounted on the board.
The main CPU is based on big.Little architecture which integrates a quad-core ARM Cortex-A73 CPU cluster and a dual core Cortex-A53 cluster with a new generation Mali-G52 GPU.
Thanks to the modern 12nm silicon technology, the A73 cores run at 2.2Ghz without thermal throttling using the stock metal-housing heatsink allowing a robust and quiet computer.
The CPU multi-core performance is around 20% faster and the GPU is 10% faster than the N1. The N2+’s DDR4 RAM is running at 1320Mhz with 1.2volt low power consumption.
The large metal housing heatsink is designed to optimize the CPU and RAM heat dissipation and minimize throttling. The CPU is placed on the bottom side of the PCB to establish great thermal characteristics.
More information is on our WiKi.
